Micron Introduces LPCAMM2 RAM Modules at CES 2024

Micron, a leading semiconductor company, has unveiled its new LPCAMM2 RAM modules at CES 2024 in Las Vegas. This innovative technology, which uses LPDDR5X RAM, is set to revolutionize laptop memory by offering significant improvements in terms of space, power consumption, and performance.

The LPCAMM2 modules take up 64% less space than traditional SODIMM memory, consume 61% less power, and are 71% faster in PCMark 10 essential workloads. The CAMM2 standard, which supports both DDR5 and LPDDR5/5X, offers a broader range of options for notebooks and certain server market segments.

Micron’s announcement comes after the JEDEC standards body officially published the CAMM2 standard in December and Samsung’s claim of being the first to announce an LPCAMM module last September. However, it’s important to note that Dell has been developing an in-house alternative to SODIMMs, called CAMM, for several years. This technology places memory chips on a module that’s screwed into a PC’s motherboard, resulting in memory that takes up far less space and has the potential to be faster and more efficient.

The benefits of CAMM2 extend beyond performance and power savings. It re-opens the doors for RAM upgrades and repairability for consumers and IT workers, which has been a significant loss with the increasing prevalence of soldered memory.

The only downside to CAMM2 is the requirement to deal with several screws when swapping out the modules. However, this small inconvenience is a fair trade-off for the potential of upgrades and the added security of screwed-in RAM.

Micron’s LPCAMM2 modules are expected to be available in capacities ranging from 16GB to 64GB. Stay tuned for more updates from CES 2024.